Fundamentals of Heat Transfer Part 1: Conduction

Fundamentals of Heat Transfer Part 1: Conduction, Conduction, Convection, Radiation, Heat Diffusion Eq., Thermal Resistance, Finned Surface, Lumped Capacitance.

In the following course, we extend thermodynamic and fluid mechanics analysis through the study of the modes of heat transfer and the development of relations to calculate heat transfer rates. The objective of this course is to lay the foundation common to the modes of conduction, convection, and radiation. We begin by addressing the questions of What is heat transfer? and How is energy transferred by heat? First, we want to help you develop an appreciation for the fundamental concepts and principles that underlie heat transfer processes. Second, we will illustrate the manner in which knowledge of heat transfer processes is used in conjunction with the first law of thermodynamics to solve problems in thermal systems engineering.

Moreover, we will understand how the heat equation, based upon Fourier’s law and the conservation of energy requirement, can be used to obtain the temperature distribution within a medium for steady-state and transient conditions. Also we want to show how thermal circuits can be used to model steady-state heat flow in common geometries such as the plane wall, cylinder, sphere, and extended surface (fin). In addition, we will solve transient conduction problems using the lumped capacitance method, which is appropriate when a single temperature can be used to characterize the time response of the medium to the boundary change. When spatial effects must be considered, we will use analytical solutions to the heat equation.